In recent sources, Intel’s upcoming LGA 1700 / LGA 1800 socket for 12th Gen Alder Lake and 13th Gen Raptor Lake CPUs has appeared in new pictures. As we know, this particular socket will be offered on the brand new 600-series chipset boards and next-generation 700-series motherboards too.
We recently witnessed the first-ever pictures of the Intel Z690 chipset, which we know will be featured on the high-end 600-series motherboard lineup. The Intel LGA 1700 / 1800 socket has more than 1700 pins, and since Intel’s Alder Lake CPUs will feature 1700 gold contact pads, most probably the future CPUs which are compatible with the socket might feature even more contacts hence the ’15R1′ has the extra 100 pins reserved for them.
According to rumours, Intel’s 12th Gen Alder Lake and 13th Gen Raptor Lake are confirmed to feature support on the LGA 1700 / 1800 socket, and Intel’s upcoming 14th Gen Meteor Lake CPUs will be launching a new socket due to a new chipset design.
Intel’s Alder Lake desktop CPUs will come in a 37.5×45.0mm package and support the ‘V0’ socket, which we know as LGA 1700. and the CPU coolers will also have to be mounted properly over the CPU as well as the new and refreshed mounting brackets need to be shipped by cooler manufacturers for Intel Alder Lake and LGA 1700 support.
| Specifications | |
| Intel LGA1700 Socket details | |
| IHS to MB Height (Z-Stack, validated range): | 6.529 – 7,532 mm |
| Thermal Solution Hole Pattern: | 78 x 78 mm |
| Socket Seating Plane Height: | 2.7 mm |
| Maximum Thermal Solution Center of Gravity Height from IHS: | 25.4 mm |
| Static Total Compressive Minimum: | 534N (120 lbf), Beginning of Life 356 N (80 lbf) |
| End of life maximum: | 1068 N (240 lbf) |
| Socket Loading: | 80-240 lbf |
| Dynamic Compressive Maximum: | 489.5 N (110 lbf) |
| Maximum Thermal Solution Mass: | 950 gm |
| Important Note: | A Keep In Zone is introduced for LGA17xx-18xx thermal solutions. Two volumes are provided. The Asymmetric volume provides the maximum available design space. The Symmetric volume provides for designs to be rotatable on the board. The thermal solution under load should fit within the volume |
The features for 600-series chipset motherboards are as follows:
- eDP / 4DDI (DP, HDMI) Display Capabilities
- 2-Channel (Up To DDR5-4800 / Up To DDR4-3200) Memory Support
- x16 PCIe 5.0 / x4 PCIe 4.0 Lanes (CPU)
- PCIe Express 4.0 & PCIe Express 3.0 Support (600-Series Chipset)
- 6 x SATA 3.0 (6 Gbps) Ports
- Up To 4 x USB 3.2 Gen 2×2 Ports
- Up To 10x USB 3.2 Gen 2×1 Ports
- Up To 10x USB 3.2 Gen 1×1 Ports
- 16 USB 2.0 Ports
- Integrated WiFi 6E/7 AX211 (CNVio) with Gig+
- Discrete Thunderbolt 4 (USB 4 Compliant)
- USB3 (20G) / USB3 (10G) / USB3 (5G) / USB 2.0
- Intel LAN PHY
- Intel Optane Memory H20 (H10 Successor)
The Intel Alder Lake Desktop CPU lineup is expected to launch in November, along with the respective Z690 platform and DDR5 memory kits.
Intel Mainstream Desktop CPU Generations Comparison:
| Intel CPU Family | Processor Process | Processors Cores/Threads (Max) | TDPs | Platform Chipset | Platform | Memory Support | PCIe Support | Launch |
| Sandy Bridge (2nd Gen) | 32nm | 4/8 | 35-95W | 6-Series | LGA 1155 | DDR3 | PCIe Gen 2.0 | 2011 |
| Ivy Bridge (3rd Gen) | 22nm | 4/8 | 35-77W | 7-Series | LGA 1155 | DDR3 | PCIe Gen 3.0 | 2012 |
| Haswell (4th Gen) | 22nm | 4/8 | 35-84W | 8-Series | LGA 1150 | DDR3 | PCIe Gen 3.0 | 2013-2014 |
| Broadwell (5th Gen) | 14nm | 4/8 | 65-65W | 9-Series | LGA 1150 | DDR3 | PCIe Gen 3.0 | 2015 |
| Skylake (6th Gen) | 14nm | 4/8 | 35-91W | 100-Series | LGA 1151 | DDR4 | PCIe Gen 3.0 | 2015 |
| Kaby Lake (7th Gen) | 14nm | 4/8 | 35-91W | 200-Series | LGA 1151 | DDR4 | PCIe Gen 3.0 | 2017 |
| Coffee Lake (8th Gen) | 14nm | 6/12 | 35-95W | 300-Series | LGA 1151 | DDR4 | PCIe Gen 3.0 | 2017 |
| Coffee Lake (9th Gen) | 14nm | 8/16 | 35-95W | 300-Series | LGA 1151 | DDR4 | PCIe Gen 3.0 | 2018 |
| Comet Lake (10th Gen) | 14nm | 10/20 | 35-125W | 400-Series | LGA 1200 | DDR4 | PCIe Gen 3.0 | 2020 |
| Rocket Lake (11th Gen) | 14nm | 8/16 | 35-125W | 500-Series | LGA 1200 | DDR4 | PCIe Gen 4.0 | 2021 |
| Alder Lake (12th Gen) | Intel 7 | 16/24 | 35-125W | 600 Series | LGA 1700 | DDR5 | PCIe Gen 5.0 | 2021 |
| Raptor Lake (13th Gen) | Intel 7 | 24/32 | 35-125W | 700-Series | LGA 1700 | DDR5 | PCIe Gen 5.0 | 2022 |
| Meteor Lake (14th Gen) | Intel 4 | TBA | 35-125W | 800 Series? | LGA 1700 | DDR5 | PCIe Gen 5.0? | 2023 |
| Arrow Lake (15th Gen) | Intel 4? | 40/48 | TBA | 900-Series? | TBA | DDR5 | PCIe Gen 5.0? | 2024 |
| Lunar Lake (16th Gen) | Intel 3? | TBA | TBA | 1000-Series? | TBA | DDR5 | PCIe Gen 5.0? | 2025 |
| Nova Lake (17th Gen) | Intel 3? | TBA | TBA | 2000-Series? | TBA | DDR5? | PCIe Gen 6.0? | 2026 |
