Intel announced its process node fabrication strategy a few years ago, with an aggressive goal of reaching 1nm by 2025. The company has made many strides over the last year and a half, with the 7nm process available in the 12th and 13th generation core processors. Intel has now announced that it is ready to begin production and manufacturing of Intel 4, the next process technology, immediately.
Song Jiqiang, President of Intel China’s Research Institute, announced at a recent meeting that the newest Intel 4 process is ready for production. The Intel 4 processor is the successor to the Intel 7 processor and will be included in the next generation, codenamed Meteor Lake.
The new Intel 14th-generation core processors will be available in the second half of this year, using the latest Intel 4 process technology.
Song went on to say that Intel 3 process technology and the following 20A / 18A process technologies are progressing as planned in the company’s efforts to provide quick competition to semiconductor leaders like TSMC and Samsung.
Intel 20A, the company’s 2nm process technology, and 18A, the company’s 1.8nm process technology, are expected to enter the manufacturing phase next year in 2024. The 20A process node will appear in the first quarter of 2024, followed by the 18A process in the second half of the year. This move is critical for Intel’s goal of becoming the company’s semiconductor leader by 2025.
The 20A and 18A process nodes will also include new RibbonFET and PowerVia chip technology. RibbonFET technology, also known as ‘ribbon field effect transistors,’ replaces FinFET technology.
PowerVia is a power delivery process that works on the backend to solve bottleneck issues in silicon architecture interconnects. It is a common issue that PowerVia should address once it is released.
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