Qualcomm and Samsung were known for making high-end Android chipsets, MediaTek surprised both firms with its Dimensity 9000. One of the numerous reasons the Korean company is considering bringing an unidentified MediaTek silicon to the Galaxy S22 FE and Galaxy S23 is the Taiwanese fabless chip maker’s new attempt at a premier SoC.
Samsung has always depended on Qualcomm’s Snapdragon and Exynos chipsets to power its Galaxy smartphones, but according to Business Korea, around half of the Galaxy S22 FE and Galaxy S23 units will be powered by an undisclosed MediaTek chipset, at least in Asia. We can infer it will be the straight successor to the Dimensity 9000, which earlier reports suggest will be called the Dimensity 1000, because the report does not specify the silicon’s name.
According to the latest source, the Galaxy S22 FE and Galaxy S23 will be released in the second half of 2022, implying that Samsung is planning an early release for these two models. The new information does not specify whether the Galaxy S23 Plus and Galaxy S23 Ultra, which are larger handsets, will be released at the same time. The Dimensity 9000 is now the fastest Android smartphone chipset available, according to a prior benchmark test, although Samsung could have other reasons for choosing a MediaTek SoC besides performance.
Galaxy S22 FE and Galaxy S23 to be cheaper
Samsung will gain a pricing edge over other manufacturers by choosing MediaTek, but the market share of the Exynos chipset will drop. According to Strategy Analytics, MediaTek had a market share of 26.3 per cent in the smartphone chipset category last year, following industry leader Qualcomm, which had a market share of 37.7%.
The South Korean giant will gain a pricing edge over other manufacturers by choosing MediaTek, but the market share of the Exynos chipset will drop. According to Strategy Analytics, MediaTek had a market share of 26.3 per cent in the smartphone chipset category last year, following industry leader Qualcomm, which had a market share of 37.7%.
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