Apple is exploring the use of TSMC’s Small Outline Integrated Circuit Packaging (SoIC) for its upcoming M5 chip, as reported recently. With Apple’s shift to using its own Apple Silicon in future Macs and AI servers, some form of advanced packaging is critical. The TSMC SoIC – which was first made public in 2018 by the company, allows for chips stacked in a three-dimensional structure. This distinctive design also improves thermal management, decreases current leakage, and enhances electrical performance compared to the conventional 2D planar chip designs.
Apple M5 to Utilize TSMC’s SoIC
Apple had been tipped a year ago to use its M2 Ultra or even the newer high-end variant of that, called Apple M4 on AI servers. The problem is, a recent paywalled report from DigiTimes, linked to by MacRumors reveals that Apple could be making plans for its AI server lineup but in the way of changing gears so it can get even more processor goodness into other machines.
Apple has been actively developing the M5 chip since late 2023. Leaks indicate the M5 will power the updated 11-inch and 13-inch iPad Pro models, although it’s unclear if the same SoIC packaging will be used in these tablet variants. Apple’s approach to utilizing unified silicon across multiple product categories is expected to yield significant cost efficiencies. Apple is able to use technology that already exists in several product lines and streamline chipset design efforts, making production more scalable.
In addition to improving devices like the iPad Pro, the M5 chip is positioned to address future requirements for AI servers. With Apple Intelligence set to launch later in the year, and increasing desire for powerful processing capabilities within the cloud computing sector, current-generation M2-Ultra along with M4 SoCs may become bottlenecking factors quite soon.
Currently, the M5 chip is in the trial production stage with volume shipments expected to kick off by as early as 2025 or even in 2026. This timeline is a reflection of Apple’s ambitions to further develop its silicon-based capabilities that are destined for both consumer devices and AI workloads suited to the enterprise.
FAQs
What are the benefits of SoIC packaging for Apple’s M5 chip?
SoIC offers enhanced thermal management, reduced current leakage, and improved electrical performance, crucial for both Macs and AI servers.
Where else might Apple deploy the M5 chip besides Macs and AI servers?
Apple’s strategy hints at potential integration across multiple device categories, leveraging unified silicon to optimize production and performance.
