AMD last year launched its first-ever CDNA GPU-based accelerator, namely the Instinct MI100. Recent reports indicate that its successor, the MI200, will be launched this year. The CDNA architecture is designed for compute-intensive and HPC workloads. It is reported that the 2nd gen of these chips is going to bring a lot of new features and technologies.
A Twitter user who goes by the name of Komachi first posted this news on his feed. We can assume that the MI200 will be replacing the MI100 as the new flagship accelerator for HPC.
We already know that AMD will be launching its EPYC Trento chips, and the Instinct MI200 is expected to be launching alongside the chipset. The MI200 is expected to launch in 2021 but we should expect a late Q4 arrival since MI100 was introduced in a similar timeframe (Q4 2020).
According to sources, the AMD MI200 is listed as an MCM ‘Special FIO Accelerator’ for HPE Cray EX. An MCM (Multi-Chip-Module) design suggests that there could be a Vega Compute GPU but two of them fused over the same PCB & connected by a next-generation Infinity Fabric interconnect.
Accelerator Name | AMD Radeon Instinct MI6 | AMD Radeon Instinct MI8 | AMD Radeon Instinct MI25 | AMD Radeon Instinct MI50 | AMD Radeon Instinct MI60 | AMD Instinct MI100 | AMD Instinct MI100 |
GPU Architecture | Polaris 10 | Fiji XT | Vega 10 | Vega 20 | Vega 20 | Arcturus | TBA |
GPU Process Node | 14nm FinFET | 28nm | 14nm FinFET | 7nm FinFET | 7nm FinFET | 7nm FinFET | Advanced Process Node |
GPU Cores | 2304 | 4096 | 4096 | 3840 | 4096 | 7680 | 7680 x 2 (MCM) ? |
GPU Clock Speed | 1237 MHz | 1000 MHz | 1500 MHz | 1725 MHz | 1800 MHz | ~1500 MHz | TBA |
FP16 Compute | 5.7 TFLOPs | 8.2 TFLOPs | 24.6 TFLOPs | 26.5 TFLOPs | 29.5 TFLOPs | 185 TFLOPs | TBA |
FP32 Compute | 5.7 TFLOPs | 8.2 TFLOPs | 12.3 TFLOPs | 13.3 TFLOPs | 14.7 TFLOPs | 23.1 TFLOPs | TBA |
FP64 Compute | 384 GFLOPs | 512 GFLOPs | 768 GFLOPs | 6.6 TFLOPs | 7.4 TFLOPs | 11.5 TFLOPs | TBA |
VRAM | 16 GB GDDR5 | 4 GB HBM1 | 16 GB HBM2 | 16 GB HBM2 | 32 GB HBM2 | 32 GB HBM2 | TBA |
Memory Clock | 1750 MHz | 500 MHz | 945 MHz | 1000 MHz | 1000 MHz | 1200 MHz | TBA |
Memory Bus | 256-bit bus | 4096-bit bus | 2048-bit bus | 4096-bit bus | 4096-bit bus | 4096-bit bus | TBA |
Memory Bandwidth | 224 GB/s | 512 GB/s | 484 GB/s | 1 TB/s | 1 TB/s | 1.23 TB/s | TBA |
Form Factor | Single Slot, Full Length | Dual Slot, Half Length | Dual Slot, Full Length | Dual Slot, Full Length | Dual Slot, Full Length | Dual Slot, Full Length | OAM |
Cooling | Passive Cooling | Passive Cooling | Passive Cooling | Passive Cooling | Passive Cooling | Passive Cooling | Passive Cooling |
TDP | 150W | 175W | 300W | 300W | 300W | 300W | TBA |