AMD’s next-generation Ryzen 7000 CPUs, codenamed Raphael and based on the 5nm Zen 4 core architecture, are the subject of new rumours. Raphael will be the codename for the next-generation Zen 4 based Ryzen Desktop CPUs, which will replace the Vermeer codenamed Zen 3 based Ryzen 5000 Desktop CPUs.
Raphael CPUs will be based on the 5nm Zen 4 core architecture and will feature 6nm I/O dies in a chiplet design, according to the information we currently have. AMD has hinted that the core counts of its next-generation mainstream desktop CPUs will be increased, so we can expect a slight increase from the current maximum of 16 cores and 32 threads.
The Zen 4 design is expected to give up to a 25% increase in IPC over the Zen 3 architecture and clock speeds of roughly 5 GHz. Stack chiplets will be present in AMD’s future Ryzen 3D V-Cache processors based on the Zen 3 architecture, and that design is expected to be carried over to AMD’s Zen 4 line of chips as well.
According to the latest speculations, AMD will announce the Zen 4 processors at Computex 2022, which would be in Q2 2022, but the launch would not happen until the end of Q3 or early Q4 2022.
AMD Ryzen ‘Zen 3D’ Desktop CPU Expected Features:
- Minor optimization on TSMC’s 7nm process node
- Up to 64 MB of Stacked cache per CCD (96 MB L3 per CCD)
- Up To 15% Average performance improvement in gaming
- Compatible With AM4 Platforms and existing motherboards
- Same TDP as existing consumer Ryzen CPUs
AMD Ryzen ‘Zen 4’ Desktop CPU Expected Features:
- Brand New Zen 4 CPU Cores (IPC / Architectural Improvements)
- Brand New TSMC 5nm process node with 6nm IOD
- Support on AM5 Platform With LGA1718 Socket
- Dual-Channel DDR5 Memory Support
- 28 PCIe Gen 4.0 Lanes (CPU Exclusive)
- 105-120W TDPs (Upper Bound Range ~170W)
The AMD AM5 CPU platform will have six different TDP segments, beginning with the flagship 170W CPU class, which is suggested for liquid coolers (280mm or higher). It appears that this chip will be aggressively clocked, with higher voltages and support for CPU overclocking. This is followed by 120W TDP CPUs, which should be cooled with a high-performance air cooler.
The 45-105W variations are categorized as SR1/SR2a/SR4 thermal segments, which indicates they’ll only need conventional heatsink solutions while running in stock mode, so they won’t need much additional to stay cool.
Kopite7kimi also mentions that the AMD AM5 platform may have two different IO dies. It is currently unknown whether these are platform-specific IO dies (PCH) or Ryzen-specific IO dies (IOD). In the case of the latter, we already know that Raphael will have a chipset design, whereas the Rembrandt APU will most likely have a monolithic design.
The leaker speculates that Zen3D, which will be included in the next-gen Ryzen mainstream lineup, will have a different IOD than Raphael, which makes sense, but it also implies that Zen3D will be released on the AM5 platform, which isn’t confirmed as previous rumours claimed Zen3D CPUs would be released on the AM4 platform.
The AMD Ryzen Raphael Desktop CPUs will have a perfect square design (45x45mm) but will have a pretty chunky integrated heat spreader or IHS, as seen in the photos. It’s unclear why it’s so dense, but it could be to spread the thermal load across numerous chiplets or for some other reason. The sides are identical to the IHS found on Intel’s Core-X HEDT processors.
In terms of the platform, AM5 motherboards will use the LGA1718 socket, which is expected to survive a long time. DDR5-5200 memory, 28 PCIe lanes, extra NVMe 4.0 and USB 3.2 I/O, and native USB 4.0 capability may be included in the platform.
The X670 flagship and the B650 mainstream will be the first two 600-series chipsets for AM5. The X670 chipset is planned to support both PCIe Gen 5 and DDR5 memory, but due to a design modification, the X670 will not be able to fit on more entry-level or ITX motherboards. As a result, ITX boards will only come in B650 varieties.
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