The MilkyWay@Home project makes use of the BOINC platform to gather volunteer computing resources to create a highly accurate three-dimensional representation of the Milky Way galaxy.
Several AMD and Intel CPU-powered computers are contributing processing power to the project, however, it appears that the project was run on an unannounced Zen 4 powered Ryzen 7000 CPU from AMD’s engineering laboratories.
The AMD Eng Sample: 100-000000665-21 N [Family 25 Model 96 Stepping 0] and the AMD Eng Sample: 100-000000666-21 N [Family 25 Model 96 Stepping 0] have both been discovered in the MilkyWay@Home database, according to BenchLeaks. The first is a 16-core component, whereas the second is an 8-core component.
According to BenchLeaks, the CPUID of these chips identifies them as AMD Raphael ES CPUs, indicating that we are looking at very early samples. While there is no further information in the database, both CPUs have 1024 KB of cache in the same benchmark, while the Ryzen 9 5950X has 512 KB cache. This is the L2 cache per core, which AMD appears to have doubled for their future Zen 4 processors. According to a new Zen 4 die layout, the ‘Priority’ and ‘backup’ cores share a 1 MB L2 cache.
The 16 core Ryzen 9 5950X (probably the Ryzen 9 7950X) would be the successor to the current flagship, the 16 core Ryzen 9 5950X, while the 8 core Ryzen 7 5800X would be the successor to the current flagship, the 8 core Ryzen 7 5800X. (presumably the Ryzen 7 7800X). There are also some performance figures, but they should be taken with a grain of salt because they differ greatly between SKUs.
AMD Ryzen 7000 Desktop CPUs: Zen 4 Core Architecture, AM5 Platform For 2H 2022
The success of AMD’s Vermeer-X is a matter of timing, as the chip will be released just a few quarters before AMD’s next major upgrade to the Ryzen platform, which is a substantial one. Raphael is the next generation of Ryzen Desktop CPUs, incorporating the Zen 4 core architecture, which is backed by an all-new AM5 platform and uses the brand new 5nm process technology.
In Halo Infinite, AMD even demonstrated a functioning prototype of its Ryzen 7000 series Zen 4 CPU running at 5 GHz across all cores.
AMD Ryzen 7000 ‘Zen 4’ Desktop CPU Expected Features:
- Brand New Zen 4 CPU Cores (IPC / Architectural Improvements)
- Brand New TSMC 5nm process node with 6nm IOD
- Support on AM5 Platform With LGA1718 Socket
- Dual-Channel DDR5 Memory Support
- 28 PCIe Gen 5.0 Lanes (CPU Exclusive)
- 105-120W TDPs (Upper Bound Range ~170W)
Raphael will be the codename for the next-generation Zen 4 based Ryzen Desktop CPUs, which will replace the Vermeer dubbed Zen 3 based Ryzen 5000 Desktop CPUs. Raphael CPUs will be based on the 5nm Zen 4 core architecture and will feature 6nm I/O dies in a chiplet design, according to the information we currently have. AMD has hinted that the core counts of its next-generation standard desktop CPUs would be increased, so we may expect a small increase from the present maximum of 16 cores and 32 threads.
The Zen 4 design is expected to give up to a 25% increase in IPC over the Zen 3 architecture and clock speeds of roughly 5 GHz. Stack chiplets will be present in AMD’s future Ryzen 3D V-Cache processors based on the Zen 3 architecture, and that design is expected to be carried over to AMD’s Zen 4 line of chips as well.
The AMD AM5 CPU platform will have six different TDP segments, beginning with the flagship 170W CPU class, which is suggested for liquid coolers (280mm or higher). It appears that this chip will be aggressively clocked, with higher voltages and support for CPU overclocking. This is followed by 120W TDP CPUs, which should be cooled with a high-performance air cooler. The 45-105W variations are categorized as SR1/SR2a/SR4 thermal segments, which indicates they’ll only need conventional heatsink solutions while running in stock mode, so they won’t need much additional to stay cool.
The AMD Ryzen Raphael Desktop CPUs will have a perfect square design (45x45mm) but will have a pretty chunky integrated heat spreader or IHS, as seen in the photos. It’s unclear why it’s so dense, but it could be to spread the thermal load across numerous chiplets or for some other reason. The sides are identical to the IHS found on Intel’s Core-X HEDT processors.
In terms of the platform, AM5 motherboards will use the LGA1718 socket, which is expected to survive a long time. DDR5-5200 memory, 28 PCIe lanes, extra NVMe 4.0 and USB 3.2 I/O, and native USB 4.0 capability may be included in the platform. The X670 flagship and the B650 mainstream will be the first two 600-series chipsets for AM5. The X670 chipset motherboards are likely to support both PCIe Gen 5 and DDR5 memory, although ITX boards are expected to only use B650 chipsets due to the increased size.
The Raphael Ryzen Desktop CPUs are also likely to include RDNA 2 onboard graphics, implying that, like Intel’s mainstream desktop range, AMD’s mainstream desktop lineup will offer GPU graphics. The number of GPU cores on the upcoming chips is expected to range between 2-4, according to speculations (128-256 cores). This will be less than the RDNA 2 CU count found on AMD’s next Ryzen 6000 APUs ‘Rembrandt,’ but it will be enough to keep Intel’s Iris Xe iGPUs at bay.
The Raphael Ryzen CPUs based on Zen 4 isn’t anticipated until late 2022, so there’s still plenty of time. The processors will compete with Intel’s Raptor Lake 13th Generation Desktop CPUs.
also read:
