Apple to Introduce 2nm A-Series Chipsets in iPhone 18 Lineup

There is considerable speculation about which lithography Apple will employ for its future iPhone series. Previous reports have claimed that Apple will switch to TSMC 2nm for A-series chipsets featured in the iPhone 17 series. But this rationale is greeted with some skepticism. On a different note, analyst Ming-Chi Kuo says that it is well possible the iPhone 18 series might be the first to take advantage of TSMC’s advanced silicon tech and the iPhone 17 will continue using another process, for cost reasons.

Apple to Use 2nm Chips in iPhone 18 Series

Kuo said Apple is likely to tap TSMC’s 3nm “N3P” process for the iPhone 17 line, marking the third generation of its advanced node technology. This follows the use of the 3nm ‘N3B’ process for the A17 Pro chip and the ‘N3E’ process for the M4, A18, and A18 Pro chips. The N3P process is expected to provide performance improvements over the previous ‘N3E’ version.

These are leading up to the iPhone 16 and 17, which is what the rumors today might accompany, disappointingly likely offering confirmation that Apple will still rely on this year’s core when making the jump to its first-gen 3nm chips. The high price tag for 2nm wafer production will likely factor into this call. Previous reports have claimed Apple will be paying around $20,000 per 3nm wafer, leading some to believe a shift to 2nm technology would be too expensive at this moment for the Cupertino company. This trend is likely to continue in the short term, even with the release of iPhone 18 in 2026.

Kuo also hints that even if Apple is able to achieve cost savings from TSMC, not every iPhone 18 variant will come with an A-series chip made on 2nm die due to the prohibitively high volume production costs. As a result, the iPhone 18 would one day gain 2nm technology while the iPhone 17 could soldier on with its thoughtful application of the still resilient and cost-effective 3nm process that would remain perfectly suitable for Apple’s near-term demands.

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