Intel’s next-generation datacenter platform, which will support ‘Granite Rapids’ and ‘Sierra Forest’ processors, will significantly improve memory bandwidth and input/output capabilities. According to a slide posted by well-known hardware leaker YuuKi AnS. However, increased performance and throughput will come at a cost: next-generation Xeon processors will have up to 500W of thermal design power.
Intel’s 6th Generation Xeon Scalable ‘Granite Rapids’ processors will have a higher high-performance core count than Sapphire Rapids and Emerald Rapids CPUs, while Intel’s Xeon ‘Sierra Forest’ processors will have an even higher core count based on energy-efficient cores designed for high-density cloud datacenters.
These Intel processors will have a TDP of up to 500W and will use Intel’s LGA7529 socket.
As a result, expect them to consume significantly more power under high loads than previous-generation parts. To feed those cores, the new CPUs will require a sophisticated memory subsystem, and the new CPUs will feature 12 DDR5 memory channels that will support both conventional DDR5-6400 memory modules (one DIMM per channel) and DDR5-8000 MCR DIMMs. When all channels are fully utilised, such a memory subsystem can provide up to 614.4 GB/s – 768 GB/s of bandwidth, which is a significant improvement over Sapphire Rapids’ 307.2 GB/s.
The new Intel datacenter processors will also have up to 96 PCIe Gen5 lanes, with the CXL protocol on top for high-performance accelerators/co-processors, storage devices, memory expanders, and other PCIe devices. In addition, 6×24 UPI links will be supported for CPU-to-CPU communication.
‘Avenue City RP’ is one of the platforms Intel is developing for its Granite Rapids and Sierra Forest processors. The motherboard will support the CPUs’ key capabilities, as well as the PFR 4.0 root of trust, a new-generation RunBMC AST26000 module, and OCP 3.0 network cards.
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