MediaTek Dimensity 7200 launched – Worth the hype?

MediaTek is back and it has the answer to Qualcomm’s recent uprising, launching its own Dimensity 7200 SoC for upcoming mid-range smartphones. This is its inaugural chipset in the new Dimensity 7000 series and comes with cutting-edge AI imaging features, powerful gaming optimizations, and impressive 5G speeds.

“The MediaTek Dimensity 7000 series will be vital for mobile gamers and photography enthusiasts who are looking for an affordable way to squeeze the most battery life out of their phones without skimping on performance,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.

New Dimensity 7200 – What’s New?

Thanks to TSMC’s 2nd gen 4nm process new Dimensity 7200 helps in power savings for extended battery life. This new chipset primarily focuses on a good performance for mid-range smartphones, promises a better gaming experience, and improvement in photography.

In terms of architecture, you have again an octa-core CPU that integrates two Arm Cortex-A715 cores, featuring operating speeds of up to 2.8GHz, with six Cortex-A510 cores to handle all easier tasks. When it comes to GPU, you have the upgraded Arm Mali G610 GPU that supports fast response times and sustains high frame rates.

To further optimize power and performance, MediaTek’s built-in AI Processing Unit (APU) maximizes the efficiency of AI tasks and AI fusion processing.

Faster RAM support up to 6400Mbps (LPDDR5) memory frequency and UFS 3.1 for maximum storage along with HDR10+, CUVA HDR and Dolby HDR support making viewing content even better. In terms of display, you get up to Full HD+ and 144Hz support which is enough for most.

Now, looking towards the camera/ISP, this Dimensity 7200 features MediaTek’s Imagiq 765 and a 14-bit HDR-ISP, which supports up to 200MP main cameras. One can also capture 4K HDR video, and the chipset also has built-in motion-compensated noise reduction. The Dimensity 7200’s APU supports powerful AI-Camera enhancements such as real-time portrait beautification.

Lastly, talking about the connectivity, this 5G chipset supports 3GPP Release-16 standard Sub-6GHz 5G modem with up to 4.7Gbps downlink and supports triband Wi-Fi 6E connectivity and next-gen Bluetooth 5.3. Also, you have Bluetooth LE Audio technology and Dual-Link True Wireless Stereo Audio for wireless earbud support.

Is it worth the hype?

It is said that the MediaTek Dimensity 7200 will power 5G devices launching in the global market in Q1 2023 and considering the rise of mid-range devices, the new chipset from MediaTek will challenge the upcoming Snapdragon 7 Gen 2 or 7+ Gen 1 whatever Qualcomm might call it.

Though this is the launch article, as more details regarding benchmark shots are up then we can have a better idea for the same. However, in the next few months expect new mid-range smartphones powered by this new Dimensity 7200 and Qualcomm answering MediaTek obviously!

via MediaTek Press Release