ASUS and Intel have collaborated to create the Supernova SoM chip package for laptops, which combines the latest Intel CPU die with LPDDR5X memory on the same package. The Supernova SoM ‘System on Module’ design, announced alongside the ASUS ZenBook Pro 16X laptop, takes the latest Intel 13th Gen CPU dies and combines LPDDR5X memory on the same interposer for a complete package that not only offers a reduction in PCB area but also enables a simpler (lower z-height) and stronger layout.

ASUS was able to optimise the power, ground, and data layers to properly match the motherboard architecture and chassis because of this design process.

ASUS has achieved this by allowing up to 155W of combined CPU and GPU power within the same chassis dimensions while lowering the motherboard core (PCB) area by 38%. (50x60mm vs 44.7x42mm). This revolutionary SOC package not only reduces motherboard area but also enables improved cooling solutions and pushes the GPU VRM to new heights, allowing for quicker graphics performance. This allows for a 15% boost in TGP over prior-gen designs.

Having LPDDR5X memory so close to the CPU allows for faster clock speeds, which improves both CPU and GPU performance. To top it all off, ASUS employs liquid cooling TIM beneath a proprietary 3D vapour chamber cooling system, which provides outstanding cooling in a stunningly tiny chassis.

Using liquid metal TIM lowers the operating temperature by 7 degrees Celsius. Aside from the inside design, the ASUS ZenBook Pro X16 OLED laptop features a variety of techniques such as Intel’s 13th Gen CPUs, NVIDIA GeForce RTX 40 Laptop GPUs with Studio-Grade drivers, and a design tailored to content makers.

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