Earlier, the South Korean-based tech giant, Samsung Electronics made an announcement stating that the company will start mass-producing 3GAE (3nm Gate-All-Around Early) and 3GAP (3nm Gate-All-Around Plus) nodes, which as the company announced, will result in incredible performance and power-efficiency gains.
However, even though Samsung had planned to commence its mass production plans earlier, according to a recent report, the production might not kick off in the first half of 2022.
in an unfortunate turn of events, Samsung Electronics announced that it will postpone its 3nm chip production until 2022. the company has not offered any reason as to why it made such an announcement however, given the events that transpired around us during the start of the year, it will be difficult for Samsung to produce a favourable number of wafers for its various clients.
We believe that Samsung has made the right call in delaying its 3nm technology instead of matching with TSMCs manufacturing capacity. This will allow the Korean manufacturer to establish a firm base, get over its experimental process earlier, and finally churn out a higher number of wafers at a faster pace to various clients.
Samsung has claimed that its 3nm technology will offer a 35 percent performance jump as well as a 50 percent power savings when compared to the company’s 7nm LPP nodes. However, it is yet to be confirmed as to how well it will fare against TSMC’s own 3nm offerings.
Unfortunately, we may have to wait to find out about the performance of TSMC’s 3nm chips because even though Apple has reportedly secured the initial 3nm chip supply from TSMC, the Taiwanese manufacturer may have to reportedly delay the production due to problems accompanied by producing chips of this category.
According to reports many of the clients have currently placed orders for 4nm nodes offered by TSMC and Samsung.
