We already know that Intel will soon be providing Server CPUs powered by the HBM technology. However, according to recent sources, AMD seems to be planning to do the same for its own EPYC Genoa variants based on the Zen 4 architecture for bandwidth-bound workloads.
According to sources, the folks at Impact-Hardware reported that they have received information suggesting that AMD is planning an HBM variant of its upcoming EPYC Genoa CPUs powered by the Zen 4 core architecture. There are many details available regarding the Genoa CPUs, however, this is the first time we are hearing about an HBM variant.
There is indeed a recurring question of an HBM version of Zen 4 among partners, but for the moment nothing seems definitively decided on this subject. The manufacturer could indeed reserve such a solution for certain customers or ultimately prefer a variation with 3D V-Cache.
We have previously heard many reports where AMD’s partners have been asking the manufacturers as to when it will start offering an EPYC CPU with HBM memory. Intel is already a step ahead of AMD since it announced its HBM variant of Sapphire Rapids, but the chips are expected to arrive in 2023, so it’s a long road ahead.
Team red is also preparing its Milan-X lineup as an intermediate entry between the Zen 3 and Zen 4. The chip will also feature a 3D chip stacking technology and the company has still not made clear whether the die stacking is based around CCD’s or V-Cache.
AMD EPYC CPU Families:
| Family Name | AMD EPYC Naples | AMD EPYC Rome | AMD EPYC Milan | AMD EPYC Genoa |
| Family Branding | EPYC 7001 | EPYC 7002 | EPYC 7003 | EPYC 7004? |
| Family Launch | 2017 | 2019 | 2021 | 2022 |
| CPU Architecture | Zen 1 | Zen 2 | Zen 3 | Zen 4 |
| Process Node | 14nm GloFo | 7nm TSMC | 7nm TSMC | 5nm TSMC |
| Platform Name | SP3 | SP3 | SP3 | SP5 |
| Socket | LGA 4094 | LGA 4094 | LGA 4094 | LGA 6096 |
| Max Core Count | 32 | 64 | 64 | 96 |
| Max Thread Count | 64 | 128 | 128 | 192 |
| Max L3 Cache | 64 MB | 256 MB | 256 MB | 384 MB? |
| Chiplet Design | 4 CCD’s (2 CCX’s per CCD) | 8 CCD’s (2 CCX’s per CCD) + 1 IOD | 8 CCD’s (1 CCX per CCD) + 1 IOD | 12 CCD’s (1 CCX per CCD) + 1 IOD |
| Memory Support | DDR4-2666 | DDR4-3200 | DDR4-3200 | DDR5-5200 |
| Memory Channels | 8 Channel | 8 Channel | 8 Channel | 12 Channel |
| PCIe Gen Support | 64 Gen 3 | 128 Gen 4 | 128 Gen 4 | 128 Gen 5 |
| TDP Range | 200W | 280W | 280W | 320W (cTDP 400W) |
