In this year’s International Supercomputing Conference Intel clearly showed its intentions of pursuing the artificial intelligence and high-performance computing market.
The all-new 3rd Generation Intel Xeon Scalable processors will be used for high-performance computing and AI purposes in supercomputers in the coming days. These high tech processing chips will integrate with the High Bandwidth Memory (HBM).
Other than that these processors also include the OAM form factor and subsystems which is accompanied by Intel’s Xe-HPC-based Ponte Vecchio GPU.
Intel has also announced the introduction of commercial support for the DAOS (distributed asynchronous object storage) along with the arrival of High Performance Networking (HPN) with the Ethernet.
Trish Damkroger, Intel’s Vice President and general manager of High-Performance Computing has stated “To maximize HPC performance we must leverage all the computer resources and technological advancements available to us.”
“Intel is the driving force behind the industry’s move toward exascale computing, and the advancements we’re delivering with our CPUs, XPUs, oneAPI Toolkits, exascale-class DAOS storage, and high-speed networking are pushing us closer toward that realization.”
Intel’s latest 3rd Gen Xeon Scalable processors reportedly yield 53% higher HPC performance when compared to Intel’s prior products.
Now with the integration of High Bandwidth Memory with Intel’s Next-Gen Xeon Scalable Processors practices Workloads such as modelling and simulation (e.g., computational fluid dynamics, climate and weather forecasting, quantum mechanics, artificial intelligence analytics, in-memory databases and storages will receive a massive boost with the arrival of the 3rd Generation Intel Xeon Scalable processors.
Moreover, Intel’s Xe-HPC GPU (Ponte Vecchio) is developed in a manner to satisfy the dynamic requirements of the upcoming supercomputer’s as powerful as the Aurora.
