The PCB pictures of the Intel Xe-HPG DG2 GPU-powered graphics card now have been leaked by Moore’s Law is Dead. It seems the pictures are the same engineering sample that was leaked back in April.
The PCB is green colored and there are 8 solder points available for the GDDR6 memory that confirm a 256-bit bus interface. Intel could appear with either 8GB or 16GB DRAM dies for the 8GB and 16GB VRAM capacities.
On the back of the PCB, there are solder joints for the two 8-pin connectors and several polymer aluminum SP-Caps (21 to be precise). The card doesn’t offer any multi-GPU connector, which might have two reasons. One, it’s being an engineering board, and two, Intel might feature mGPU functionality over the PCIe Gen 4.0 lanes, similar to AMD.
The interesting part of this leak is, it is similar to the first package photo of the Xe-HPG DG2 GPU that was leaked by Igor’s Lab. The GPU package comes with 42.5 x 37.5mm dimensions and this GPU die will definitely be much smaller than the package.
Intel Xe-HPG DG2 512 EU chip is said to be featured clock speed up to 2.2 GHz though it is unknown if these are the average clocks or the maximum boost clocks. This card is coming to both desktop and mobility designs later in 2021 and could be based on TSMC’s 6nm node.
According to the leakers, the card will be launched in Q4 2021 or early 2022. The successor to DG2 will be named Elasti ‘DG3’ having a release date scheduled for 2023. The mid-range cards are expected to have a price tag around $200-$300 US. The higher-end variants could come with a price of starting at $349 and up to $499 US.
