Yesterday, Samsung introduced its newly developed advanced clip packaging technology for the high-performance application.
With the all-new next-generation 2.5D packaging technology, the all-new Interposer-cube (I-Cube 4) is expected to be used in certain areas such as High-performance computing, Artificial Intelligence (AI), 5G and cloud and data computing.
I-Cube is Samsung’s all new brand of heterogenous technology which horizontally places one or more logic dies such as Central Processing Units (CPU) and Graphics Processing Units (GPU) as well as few high bandwidth memory (HBM).
Samsung adds that it is a uniquely mould-free structure for the I-cube. It also incorporates 4 HBM’s with one logic die.
The I-Cube 4 provides enhanced communication and power efficiencies between logic and memory chips. It is also reported that it performs better Thermal management and provides a stable power supply. Further on, Test run has also shown improved yields making this new technology a big step ahead.
Samsung has also announced that they will try to incorporate more chips in one package in the coming days.
And this is all there’s to know about this new development. Do share your opinions on this in the comment box below.
