Tuesday, August 16, 2022

Intel Raptor Lake CPU to feature a slight bigger die than Alder Lake

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Expreview, a Bilibili video creator and tech outlet, has revealed the first images of a delid 13th Gen Intel Raptor Lake CPU. The very bizarre video depicts the user deliding the chip, fracturing off a single capacitor, re-fusing it, then testing the chip on an ASUS Z690 board to see whether it functions. Unfortunately, it did not.

The Core i9-13900 Engineering sample of the Intel 13th Gen Raptor Lake CPU that is displayed in the movie has 24 cores and 32 threads. This shouldn’t be confused with the top Core i9-13900K, which has the identical die configuration but a significantly higher TDP and faster clocks. The 13th Gen Raptor Lake CPUs, like the 12th Gen Alder Lake CPUs, will be available in two configurations: a C0 die with the full core configuration and a smaller, scaled-down C0 die that can accommodate up to 6 P-Cores.

To provide the optimum thermal transmission between the die and heat spreader, Intel is once more adopting a premium solder design with a gold-plated IHS. The CPU lacks the liquid metal TIM that AMD employs for their Ryzen chiplets but has high-end TIM between the die and IHS. 

With dimensions of 23.8 x 10.8mm or 257.04mm, the Raptor Lake H0 die appears to be a little larger than the Alder Lake H0 die.

Raptor Lake
credit: wccftech

The Alder Lake top-dimensions die’s are 20.4 x 10.2mm, or 208.08mm2, for reference. This represents a 24 percent increase in die area, which makes logical given that the new CPUs will include more Gracemont E-Cores and larger L2/L3 caches than the parts from the previous generation.

Another leaker who posted this picture on the Baidu forums also revealed some fascinating information. According to reports, the 13th generation Raptor Lake processors from Intel would have a 400–420W maximum power restriction, which is more than the 300–330W limit of the 12th generation Alder Lake processors.

The new chips operate cooler while using the same amount of power and cooling, which is a result of greater die surface area coverage, despite the fact that the power limit is significantly higher.

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Nivedita Bangari
Nivedita Bangari
I am a software engineer by profession and technology is my love, learning and playing with new technologies is my passion.


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