As suspected with the leak we received yesterday, new Milan-X processors will be launching in the market, launched at CES 2022. AMD has today announced the world’s first data center CPU using 3D die stacking, the 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology, formerly code-named “Milan-X.”
As the highest-performing x86 server CPUs for technical computing, these latest processors deliver the industry’s largest L3 cache, leadership packaging innovation and modern security features. These new Milan-X server processors can deliver up to 66% performance uplift across a variety of targeted technical computing workloads versus comparable, non-stacked 3rd Gen AMD EPYC processors.
“Building upon our momentum in the data center as well as our history of industry-firsts, 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology showcase our leading design and packaging technology enabling us to offer the industry’s first workload-tailored server processor with 3D die stacking technology,” said Dan McNamara, senior vice president and general manager, Server Business Unit, AMD.
“Our latest processors with AMD 3D V-Cache technology provide breakthrough performance for mission-critical technical computing workloads leading to better-designed products and faster time to market.”
| Cores | Model | # CCD | TDP (W) | cTDP range (W) | Base Freq (GHz) | Max Boost Freq (Up to GHz)* | L3 Cache(MB) | DDRChannels | Price(1KU) |
| 64 | 7773X | 8 | 280 | 225 – 280 | 2.20 | 3.50 | 768 | 8 | $ 8,800 |
| 32 | 7573X | 8 | 280 | 225 – 280 | 2.80 | 3.60 | 768 | 8 | $ 5,590 |
| 24 | 7473X | 8 | 240 | 225 – 280 | 2.80 | 3.70 | 768 | 8 | $ 3,900 |
| 16 | 7373X | 8 | 240 | 225 – 280 | 3.05 | 3.80 | 768 | 8 | $ 4,185 |
*Max boosts for AMD EPYC processors is the maximum frequency achievable by any single core on the processor under normal operating conditions for server systems.
- Outstanding leadership performance in technical computing workloads:
- EDA – The 16-core, AMD EPYC 7373X CPU can deliver up to 66 percent faster simulations on Synopsys VCS™, when compared to the EPYC 73F3 CPU.
- FEA – The 64-core, AMD EPYC 7773X processor can deliver, on average, 44 percent more performance on Altair® Radioss® simulation applications compared to the competition’s top of stack processor.
- CFD – The 32-core AMD EPYC 7573X processor can solve an average of 88 percent more CFD problems per day than a comparable competitive 32-core count processor, while running Ansys® CFX®.
As the leak suggested, AMD has launched four new SKUs: 64, 32, 24, and 16-core options. This includes the flagship CPU i.e. EPYC 7773X featuring 64 Zen 3 cores supercharged by 768MB L3 cache, which comes with a TDP of 280W and a whopping price tag of $8,800. All of these processors come with 8 CCDs and each of these chiplets is equipped with 96MB of L3 Cache (64+16MB).
Coming to the other SKUs, the 32-core SKU called the EPYC 7573X will cost you $5,590 while the more affordable 24 and 16 core models, known as EPYC 7473X and 7373X respectively will come with a TDP of 240W and will shed $3,900 and $4,185.
These new 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology are now available today from a wide array of OEM partners, including, Atos, Cisco, Dell Technologies, Gigabyte, HPE, Lenovo, QCT, and Supermicro.
