Recently, MediaTek launched the new Dimensity 8000 series 5G SoCs for premium 5G smartphones, alongside them it has brought a new mid-range SoC in the form of new Dimensity 1300. It is based out of TSMC’s 6nm process and is a 5G chip with good performance for upcoming mid-range smartphones.
The Dimensity 1300’s HDR-ISP supports up to 200MP and integrates MediaTek’s HyperEngine 5.0 to offer an optimal balance between performance and power for better efficiency in gaming and daily use scenarios. It comes with new AI enhancements, improving night shot photography and HDR capabilities for great image clarity.
The MediaTek Dimensity 1300 integrates an octa-core CPU with an ultra-core Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores, along with an Arm Mali-G77 GPU and MediaTek APU 3.0 to support the latest AI capabilities.
The Dimensity 1300 boosts AI benchmark scores from the six-core APU 3.0 by up to 10%, giving greater capacity for AI tasks. The SoC also supports 4K HDR Video with 3-Exposure Fusion while also supporting super-fast refresh rate displays whilestill being very efficient for daily work, and you have MediaTek 5G UltraSave power saving enhancement suite if you use 5G networks too often.
Smartphones powered by the Dimensity 8100, Dimensity 8000 and Dimensity 1300 will be available in the market in the first quarter of 2022, powering a new era of incredible 5G devices by some of the world’s biggest smartphone brands.
