MediaTek is improving and growing day by day, not only based on price to performance ratio but also on market cap. The chip-maker has already entered into the flagship market back in December 2021 and to proceed further, added Dimensity 8000 in the pipeline for launch. Post the teaser, multiple leaks indicate the Dimensity 8100 is also coming along with it.
Two sources, Digital Chat Station and It’s Fat have confirmed MediaTek could launch both Dimensity 8000 and Dimensity 8100 together on 1st March; however, there is no official confirmation yet.
As per the Chinese source, It’s Fat, the upcoming Dimensity 8000 is built on the same node as the Diamensity 9000, which is 4nm. The Digital Chat Station, on the other hand, is telling that MediaTek has adopted 5nm architecture for this SoC. The leaks also informed we can see the use of ARM’s V9 architecture along with Mali-G510 GPU atleast.
All the architecture-related leaks of Diamensity 8000 are also applicable for the rumoured Diamensity 8100. It will be a slightly overclocked and better binned version. Due to these, probably, leaks are also saying the Diamensity 8100 will be accepted more by the smartphone makers. Alongside a few smartphones like Redmi K50 and Realme GT Neo 3 are already set to feature the overclocked variant.
Digital Chat Station has released the early benchmark details of the Dimensity 8000. The SoC scored 820,230 in total, 197,563 in CPU, and 315,470 in GPU. Point to note, with proper hardware and software, for example – a handset with this SoC ready to come on the market, these figures will improve for sure. In comparison, the Snapdragon 888 on OnePlus 9 Pro generate 806,964 in total, 198,510 in CPU, and 317,247 in GPU. So, it’s obvious that the performance of Diamensity 8100 will be capable enough to directly challenge the Snapdragon 888 in both CPU and GPU.
Good post
The Mediatek Dimensity 8100 will give some tough competition to its Qualcomm counterparts. Very impressive.