The South Korean tech giant’s memory production division is making some major progress in the development of its latest venture. The company has already demonstrated that the 512 GB DDR5 memory modules are possible to manufacture. This was a breakthrough and Samsung has announced that it will start rolling out the technology in late 2021 in time for the release of Intel’s Sapphire Rapids.
But, this is not the only thing which the South Korean giant is working on, as it recently revealed in its latest Q2 2021 earnings call that the company is also developing specific modules designed for cloud data centers.
As we know, its 512 GB modules use 32x 16 GB stacks with each integrating 8x 16 Gb DRAM chips. The company is also planning on expanding its total module capacity to 768 GB by using 24 Gb memory chips. This is so that a server CPU that supports eight memory channels with two modules per channel can accommodate at least 12 TB of DDR5 RAM.
Samsung also announced that it will be mass-producing both its 512 and 768 GB modules on Samsung’s D1a nodes with 14 nm EUV tech. Though there are many limitations to the data server modules, Samsung intends to add the new 24 Gb memory chips to mainstream and ultra-dense server modules with 96 / 192 / 384 GB capacities. It is also planning to make it consumer PC modules with 24 GB and 48 GB capacities.
For now, Samsung is yet to disclose the exact time frame for the production of 24 Gb DDR5 memory chips, however, it believes that the 512 GB modules will be enough for the Intel Sapphire Rapids servers. Experts believe that we can expect to see the commercial availability for the 24 Gb chips sometime in 2023.
