Intel’s Xe-HPG DG2 512 EU might be released during CES 2022

According to a popular Chinese hardware account at Weibo, Intel will be launching its first discrete graphics cards based on the Xe-HPG DG2 GPU architecture at CES 2022. Now this card has been a topic for some heated discussions and we know that this will be intel’s first entry into the discrete GPU market after nearly a decade.

Sources state that this is reliable information and that the DG2 GPUs will be making their formal debut in the retail market at CES 2022 which is scheduled for next January. Reports also suggest that we will also get a teaser of the cards around the end of October during the Intel Innovation event.

So let’s stop wasting our time and have a look at the cars which Intel will most probably be released at CES 2022.

Intel Xe-HPG DG2 512 EU Discrete Gaming Graphics Cards

this is the top variant in the DG2 512 EU line up and it will utilize the full die with 4096 cores, 256-bit bus interface, and will sport up to 16 GB GDDR6 memory.

The chip will reportedly measure at around 396mm2 and is bigger than the AMD RDNA 2 and NVIDIA Ampere offerings. And it will also come in the BGA-2660 package which measures 37.5mm x 43mm.

Intel Xe-HPG DG2 384 EU Discrete Gaming Graphics Cards

Next, we have Intel’s Xe-HPG DG2 384 GPU SKU and will reportedly comprise at least three variants. The chip will feature 3072 cores and up to 12 GB GDDR6 memory. We also have a listing that shows the chip sporting 6 GB GDDR6. The card will also have a 192-bit bus interface.

The other two variants include a 256 EU and a 192 EU variant and both will be comprised of 2048 and 1536 cores respectively. Both of these variants will feature a 128-bit bus interface, however, the 256 EU SKU will come with up to 8 GB GDDR6 memory and the 192 EU variant will have just 4 GB GDDR6 memory.

Intel Xe-HPG DG2 128 EU Discrete Gaming Graphics Cards

lastly, we have the Intel Xe-HPG DG2 128 EU coming with 1024 cores, and a 64-bit bus interface, along with 4 GB GDDR6 memory. There is also a cut-down variant that will come with 96 EUs or 768 cores and will sport 4 GB GDDR6 memory featured with a 64-bit bus interface.

Intel Xe-HPG DG2 GPU Specifications

 SKU 1SKU 2SKU 3SKU 4SKU 5
Package typeBGA2660BGA2660BGA2660TBCTBC
Supported Memory TechnologyGDDR6GDDR6GDDR6GDDR6GDDR6
Memory speed16 Gbps16 Gbps16 Gbps16 Gbps16 Gbps
Interface / bus256-bit192-bit128-bit64-bit64-bit
Memory Size (Max)16 GB12 GB8 GB4 GB4 GB
Smart cache size16 MB16 MB8 MBTBCTBC
Graphics Execution Units (EUs)512384256196128
Graphics Frequency (High) Mobile1.1 GHz600 MHz450 MHzTBCTBC
Graphics Frequency (Turbo) Mobile1.8 GHz1.8 GHz1.4 GHzTBCTBC
TDP Mobile (Chip Only)100100100TBCTBC
TDP desktopTBCTBCTBCTBCTBC

Intel Xe-HPG DG2 GPU Based Discrete Gaming Graphics Card Specs:

GPU VariantGPU SKUExecution UnitsShading Units (Cores)Memory CapacityMemory BusTGP
Xe-HPG 512EUDG2-512EU512 EUs409616/8 GB GDDR6256-bit~275W
Xe-HPG 384EUDG2-384EU384 EUs307212/6 GB GDDR6192-bitTBC
Xe-HPG 256EUDG2-384EU256 EUs20488/4 GB GDDR6128-bitTBC
Xe-HPG 192EUDG2-384EU192 EUs15364 GB GDDR6128-bitTBC
Xe-HPG 128EUDG2-128EU128 EUs10244 GB GDDR664-bitTBC
Xe-HPG 96EUDG2-128EU86 EUs7684 GB GDDR664-bit~120W

source

LEAVE A REPLY

Please enter your comment!
Please enter your name here

This site uses Akismet to reduce spam. Learn how your comment data is processed.

More like this

Intel CEO Lip Bu Tan

Intel CEO Lip Bu Tan: Is Intel’s New CEO...

Intel CEO Lip Bu Tan: $200M+ Investments in Chinese Companies Spark Controversy and Security Concerns Intel’s recent appointment...

Moto Book 60 Laptop Set to Launch in India...

Motorola has announced its first-ever notebook, the Moto Book 60, marking the brand’s official entry into the...
Intel

Intel Wins Nintendo Switch 3 GPU Battle, AMD Faces...

Intel clinches a Nintendo Switch 3 GPU deal with a 18A process, while AMD grapples with a...
AMD

AMD Surges Ahead in 2025: Gains 16.6% CPU Market...

In a dramatic shift in the CPU landscape, AMD has pulled off one of its biggest wins...
Intel’s Highly-Anticipated 18A Process Enters “Risk Production”; Foundry Division Geared Up To Make a Comeback

Intel’s 18A Chip: A Game-Changer in Risk Production

Intel’s 18A chip enters risk production, signaling a potential comeback in the semiconductor industry. Learn about its...

LATEST NEWS

Oppo A5 Pro 5G Launching in India on April 24: Price Revealed

Oppo will unveil the A5 Pro 5G on April 24 in India, and ahead of its official launch, the pricing of the smartphone has...

Trump New Semiconductor Tariffs to Hit Apple and Tech Industry Hard — “No One Getting Off the Hook”

Trump New Semiconductor Tariffs : In a move that could reshape the global electronics supply chain, former U.S. President Donald Trump is preparing a...

iPhone 18 Prices May Rise Due to 2nm Chip Tariffs

Exclusive: TSMC’s 2nm chips could push iPhone 18 prices sky-high. Discover why Apple’s next flagship might cost more than ever before. The Price of Progress:...

My Dearest Nemesis Finale: Workplace Rivals to Lovers in Heartwarming K-Drama Conclusion

In the glittering world of K-dramas, where workplace romances and family dynamics intertwine to create compelling narratives, “My Dearest Nemesis” has carved out a...

Featured