In the latest news, we have the latest rendered images of AMD’s next-generation AM5 CPU socket. This will be supporting the company’s upcoming 2022’s Ryzen Desktop CPUs. The credit of posting the rendered images online to show them to us goes to ExecutableFix.
As we know from previous leaks and rumors that the upcoming AMD’s AM5 platform will bring a host of new features while also carrying the latest LGA 1718 socket designed to support the next-generation Ryzen Desktop.
The rendered images show that the design of the AM5 ‘LGA 1718’ socket is very similar to the existing Intel CPU sockets. It has a single latch and will be featuring a land grid array packaging. Some pins will be featured in the socket itself making contact with the LGA pads under the processor.
According to images, AMD’s Ryzen Raphael Desktop CPUs will also be featuring a perfect square shape (45x45mm) while also housing an integrated heat spreader or IHS.
‘Mark, Mike, and the teams have done a phenomenal job. We are as good as we are with the product today, but with our ambitious roadmaps, we are focusing on Zen 4 and Zen 5 to be extremely competitive.
‘There will be more core counts in the future – I would not say those are the limits! It will come as we scale the rest of the system.’
AMD’s Rick Bergman on Next-Gen Zen 4 Cores For Ryzen CPUs
Q- How much of the performance gains delivered by AMD’s Zen 4 CPUs, which are expected to use a 5nm TSMC process and might arrive in early 2022, will come from instructions per clock (IPC) gains as opposed to core count and clock speed increases.
Bergman: “[Given] the maturity of the x86 architecture now, the answer has to be, kind of, all of the above. If you looked at our technical document on Zen 3, it was this long list of things that we did to get that 19% [IPC gain]. Zen 4 is going to have a similarly long list of things, where you look at everything from the caches, to the branch prediction, [to] the number of gates in the execution pipeline. Everything is scrutinized to squeeze more performance out.”
“Certainly [manufacturing] process opens an additional door for us to [obtain] better performance-per-watt and so on, and we’ll take advantage of that as well.”
|AMD CPU Family||Codename||Processor Process||Processors Cores/Threads (Max)||TDPs||Platform||Platform Chipset||Memory Support||PCIe Support||Launch|
|Ryzen 1000||Summit Ridge||14nm (Zen 1)||8/16||95W||AM4||300-Series||DDR4-2677||Gen 3.0||2017|
|Ryzen 2000||Pinnacle Ridge||12nm (Zen +)||8/16||105W||AM4||400-Series||DDR4-2933||Gen 3.0||2018|
|Ryzen 3000||Matisse||7nm (Zen 2)||16/32||105W||AM4||500-Series||DDR4-3200||Gen 4.0||2019|
|Ryzen 5000||Vermeer||7nm (Zen 3)||16/32||105W||AM4||500-Series||DDR4-3200||Gen 4.0||2020|
|Ryzen 6000||Warhol?||7nm (Zen 3D)||16/32||105W||AM4||500-Series||DDR4-3200||Gen 4.0||2021|
|Ryzen 7000||Raphael||5nm (Zen 4)||16/32?||105-170W?||AM5||600-Series?||DDR5-4800?||Gen 4.0||2021|
|Ryzen 8000||Granite Ridge||3nm (Zen 5)?||TBA||TBA||AM5||700-Series?||DDR5-5000?||Gen 5.0?||2023|