According to recent sources, Taiwan Semiconductor Manufacturing Company (TSMC) is finalizing stages of confirming some crucial contracts for its chip manufacturing facility in the United States. As we know, the chip manufacturer has laid out $12 billion of investment for its plant, and it’s expected that its new fab will commence mass-producing the company’s 5nm chip process node by 2024.
As to whether the deals are indeed being finalized have not yet been made confirmed by TSMC as of yet, now TSMC is busy soliciting its Taiwanese suppliers to set up its base in the U.S. and supplying the plant with the necessary equipment for the process of chipmaking.
Here’s some information about TSMC’s latest fab facility in the United States. The plant will be built in Arizona, which is already the house of the world’s largest chipmaker, Intel Corporation. Its also been officially announced that contracts for the plant would be finalized by July, and installation of manufacturing equipment would start in September of next year.
According to recent rumours, contracts for services such as cleanroom equipment are in their final stages, and the contracts will be finalized before TSMC’s upcoming investor conference. The conference will be held on the 15th of this month, and investments for the second quarter will be decided during the conference.
The plans officials plan to send more than 20 of its top engineers to the U.S. The chip manufacturer also plans to hire roughly 200 personnel in the country. According to reports, the plant construction costs are higher in America, and TSMC can build “three or four factories” in Taiwan at the same cost.
Currently, the chipmaker will be mass-producing its 5nm chip process node and will soon kick off the production of the 3nm node starting next year. And if we follow the timeline which TSMC has provided for its Arizona fab, then by the time the plant starts its production and shipment of its wafer, TSMC would have already replaced the 5nm process nodes with more advanced tech.
