New images of Intel’s next-gen Sapphire Rapids Xeon CPU dies leaked

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According to fresh rumors and leaks, a new image of the die of Intel’s next-gen Sapphire Rapids Xeon CPUs has surfaced online. These new images show us the MCM design that could house up to 60 cores. The leak is provided to us by Yuuki-AnS which shows a close-up of the dies that will power the 4th Gen Xeon lineup.

Last month also we got some leaked images of Intel’s 4th Gen Sapphire Rapids Xeon CPU dies however, it was a mystery as to what was inside those dies. This time, the leaker managed to expose each of the four chipsets dies on the main interposer.

So, there is a 4×4 (1 IMC tile) core configuration which means each die consists of up to 15 cores. It should be 16 core but 1 of the core area is taken up by the IMC. Therefore there are only 15 cores however, 1 core is disabled for better yields. This means that each die will in fact feature 14 cores for a total of 56 cores per CPU.

However, previous speculations also indicate that the Sapphire Rapids-SP Xeon CPUs could feature a maximum of 60 cores and 120 threads but we know from previous leaks that the maximum configuration is going to end up at 56 cores and 112 threads. Previously we also mentioned that some leaks offered insight on an ES chip that featured a total of 60 cores. But that chip only had 56 cores (14 cores per die) enabled.

Intel Xeon SP Families:

Family BrandingSkylake-SPCascade Lake-SP/APCooper Lake-SPIce Lake-SPSapphire RapidsEmerald RapidsGranite RapidsDiamond Rapids
Process Node14nm+14nm++14nm++10nm+10nm Enhanced SuperFin?10nm Enhanced SuperFin?7nm?sub-7nm?
Platform NameIntel PurleyIntel PurleyIntel Cedar IslandIntel WhitleyIntel Eagle StreamIntel Eagle StreamIntel Mountain Stream
Intel Birch Stream
Intel Mountain Stream
Intel Birch Stream
MCP (Multi-Chip Package) SKUsNoYesNoNoYesTBDTBD (Possibly Yes)TBD (Possibly Yes)
SocketLGA 3647LGA 3647LGA 4189LGA 4189LGA 4677LGA 4677LGA 4677TBD
Max Core CountUp To 28Up To 28Up To 28Up To 40Up To 56?TBDTBDTBD
Max Thread CountUp To 56Up To 56Up To 56Up To 80Up To 112?TBDTBDTBD
Max L3 Cache38.5 MB L338.5 MB L338.5 MB L360 MB L3TBDTBDTBDTBD
Memory SupportDDR4-2666 6-ChannelDDR4-2933 6-ChannelUp To 6-Channel DDR4-3200Up To 8-Channel DDR4-3200Up To 8-Channel DDR5-4800Up To 8-Channel DDR5-5200?TBDTBD
PCIe Gen SupportPCIe 3.0 (48 Lanes)PCIe 3.0 (48 Lanes)PCIe 3.0 (48 Lanes)PCIe 4.0 (64 Lanes)PCIe 5.0 (80 lanes)PCIe 5.0PCIe 6.0?PCIe 6.0?
TDP Range140W-205W165W-205W150W-250W105-270WUp To 350W?TBDTBDTBD
3D Xpoint Optane DIMMN/AApache PassBarlow PassBarlow PassCrow PassCrow Pass?Donahue Pass?Donahue Pass?
CompetitionAMD EPYC Naples 14nmAMD EPYC Rome 7nmAMD EPYC Rome 7nmAMD EPYC Milan 7nm+AMD EPYC Genoa ~5nmAMD Next-Gen EPYC (Post Genoa)AMD Next-Gen EPYC (Post Genoa)AMD Next-Gen EPYC (Post Genoa)


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Nivedita Bangari
I am a software engineer by profession and technology is my love, learning and playing with new technologies is my passion.

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