Realme has already announced that they are one of the pioneers to launch a flagship smartphone powered by the MediaTek Dimensity 1200 5G chipset. It is the latest chipset MediaTek launched today. The flagship chipset gets the new Cortex-A78 core and it will run it at 3.0GHz (according to ARM’s official numbers, this means 20% higher single-core performance than the previous generation).

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The upcoming Realme flagship device is expected to be a X9 series smartphone and most likely to be the Pro version of the series. A new X series is being teased by CEO Madhav Seth and some images has also been posted by him. Those images are of the upcoming flagship that is way more thin than other Realme devices and other smartphones as well.

Also read: Redmi is set to launch a flagship device with MediaTek Dimensity 1200 5G processor

Realme X9 slim profile teased by company CEO

Specifications of Realme X9 Pro (rumored):

  • 6.4-inch OLED 120Hz display
  • MediaTek Dimensity 1200 5G processor
  • 108MP primary + 13MP + 13MP (likely telephoto + UW)
  • 12GB LPDDR5 RAM
  • 128GB/256GB storage
  • Android 11 with Realme UI 2.0
  • 4,500mAh battery
  • 65W charging

Also read: Redmi K40 tipped to feature the sub-flagship Snapdragon 870 processor and K40 Pro’s price leaked

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