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Xiaomi Mi 11 render reveals curved edge display and triple rear camera module

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In the upcoming 2021, many smartphone companies are expected to introduce their smartphones with the flagship 888G chipset. The Xiaomi Mi 11 is one of those smartphones on this list which comes with Snapdragon 888SoC.

A reliable tipster @Ben_Geskin has tweeted a post revealing the image of the upcoming Xiaomi Mi 11 which gives us a clear concept of the design and some features of this upcoming device. Let’s check out all this information.

Looking at the image of Xiaomi Mi 11 we can observe a full front display body with curved edges on all four sides. The phone will sport a 6-inches QHD+AMOLED display. The display would at least feature a 2K resolution and a 120Hz of refresh rate. The phone is expected to have an under-display fingerprint sensor.

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The source also reveals some information about the camera sensors of this phone. The Xiaomi Mi 11 comes with a triple rear camera setup which includes- 108 Megapixels of a primary snapper, a 13 MP ultra-wide shooter, and a 5MP telephoto snapper. According to the renders, the smartphone will have a square camera module on the backside with the primary and secondary lenses are placed vertically. Another source also reveals an Infrared(IR) blaster on the smartphone. On the front side, there will be a punch hole shaped cutout to hold a 20 MP selfie camera. Though there is no official confirmation about the camera lenses.

The Co-Founder and CEO of Xiaomi Lei Jun have already confirmed that the Mi 11 will have the newly launched Snapdragon 888 chipset. It is predicted that the Mi 11 will have 8GB LPDDR5 and 128GB of inbuilt UFS 3.1 storage configuration. According to the source, the Mi 11 will have 4,780 mAh of battery life with a 50W wired and 30W wireless charging facility.

All the above information are based on the source, there is no official confirmation is reported till now. It is highly expected that the Xiaomi Mi 11 will arrive in December 2020 or January 2021.

Source | Via 1 • Via 2

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