The Taiwan chip manufacturing giant wants to leap forward with its rapid advancements in the semiconductor industry and wants to invest more in its advanced process manufacturing. The global leader, according to Digitimes, plans to invest US$5.27 billion to both install and expand its advanced technology capacity.
TSMC is already delivering 5nm process nodes and now it plans to deliver 4nm and 3nm process nodes while its 2nm node is in research. This huge investment is towards installation of specialty technology and advanced packaging capacity along with fab construction, installation of fab facility systems and capitalized leased assets, fourth-quarter 2020 R&D capital investments and sustaining capital expenditures.
Digitimes’ report state:
TSMC’s board also approved a NT$2.50 per share cash dividend for the second quarter of 2020, when the company reported net profits surged 81% on year and a slight 3.3% sequentially to NT$120.82 billion (US$4.1 billion) with EPS coming to NT$4.66, or US$0.78 per ADR unit.
In addition, the board approved the issuance of US dollar-denominated unsecured corporate bonds for up to US$1 billion and the provision of a guarantee to TSMC Global, a wholly-owned foreign subsidiary of TSMC, for its issuance of US dollar-denominated senior unsecured corporate bonds for up to US$3 billion. Proceeds from the bond issue are to finance TSMC’s capacity expansion.
The major demand in TSMC’s chips has made it the world’s no 1 chip manufacturer beating the likes of Samsung, Intel and others. Obviously, it plans big in future with these kinds of investments and the company has even promoted its business development VP Kevin Zhang to be the company senior VP.
However, China is not looking Taiwan’s progress in chip industry as a good sign and for that it is recruiting talents from TSMC, and the Taiwan semiconductor should do something about it first to keep its secrets confidential. Read more from here:
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