Following the announcement of flagship Exynos 990 SoC, Samsung has also made a massive announcement recently at Samsung’s annual Tech Day event at their Device Solutions headquarters in San Jose, California. Samsung Electronics has officially begun the mass production of world’s first 12GB double-data UFS multi-chip package. The uMCP i.e. the Multi-Chip Package combines both … Continue reading Samsung announces 12GB LPDDRX4 RAM & UFS 3.0 storage combo for mid-range smartphones