The most innovative product that Microsoft introduced us recently is the Surface Neo which is a dual-screen hybrid computing device. It runs on Microsoft’s custom Windows 10X that perfectly helps this dual-screen computing device work effectively.

The Microsoft Neo features two 9-inch displays, a fold-out keyboard, a 360° hinge and is compatible with the Surface Slim Pen that docks on the rear of the device. Also, this is the first device that features Intel’s 11th-generation Lakefield processor based on the 10nm process.

Surface Neo will use Intel's upcoming 10nm Lakefield CPUs with 5W & 7W TDP

The Lakefield CPU features a primary Sunny Cove core, four 10-nanometer “Tremont” cores and Foveros 3D chip stacking technology. It will be accompanied with Intel’s latest Gen 11 integrated graphics. This mix of various CPU cores will allow small-form-factor devices to deliver both performance and power efficiency at the same time.

The Lakefield CPUs will have 5 W and 7 W thermal design powers (TDP), although Microsoft has not yet confirmed which variant it will include in the Neo.

Surface Neo will use Intel's upcoming 10nm Lakefield CPUs with 5W & 7W TDP

The Lakefield CPUs are very futuristic and they operate more like the ARM processors found in smartphones than the traditional CPUs that have been powering both laptops and desktop. Foveros is essentially an evolution of this 2D integration, in which other components can be stacked on top of each other in a form of logic-on-logic integration.

It’s packed with more than one type of CPU core to create a more stable and power-efficient system almost as we see in smartphone SoCs. Also, these hybrid SoCs can even come with their own integrated memory, I/O interface, wireless connectivity and integrated CPUs.

Surface Neo will use Intel's upcoming 10nm Lakefield CPUs with 5W & 7W TDP

Microsoft’s Panos Panay even said that the Lakefield chip for the Surface Neo has been specifically designed for dual-screen systems. Intel has managed to reduce the silicon size to a circuit board just half the usual size, the idea is making the device powerful even though being compact in size.

Microsoft has gone back to ARM chips for its Surface Pro X but with Intel’s 3D 10-nanometer tech, we will see more of this thin and pocket-friendly yet powerful devices in the near future. What do you think about the Lakefield CPUs? Tell us in the comments below. 😊

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